Sales of Amkor Technology’s Next Generation Through Mold Via Package-on … – MarketWatch (press release)

Sales of Amkor Technology's Next Generation Through Mold Via Package-on
MarketWatch (press release)
“This is a significant milestone for a technology we launched just last year,” said Mike Lamble, Amkor's executive vice president, worldwide sales and product management. “Today, most smartphones and tablets utilize PoP for CPU and memory stacking.

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Tuesday, December 20th, 2011 CPU

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