Sales of Amkor Technology’s Next Generation Through Mold Via Package-on … – Business Wire (press release)

Sales of Amkor Technology's Next Generation Through Mold Via Package-on
Business Wire (press release)
“Today, most smartphones and tablets utilize PoP for CPU and memory stacking. With the higher integration and density trends in these devices, we are seeing a rapid transition to TMV PoP solutions.” “This is a significant milestone for a technology we

Tuesday, December 20th, 2011 CPU

No comments yet.

Leave a comment

You must be logged in to post a comment.

Search

 

Admin

Categories

Tags